Technical Details

• Package / Case 900-BBGA, FCBGA
• Speed 667MHz
• RAM Size 256KB
• Number of I/O 130
• Operating Temperature 0°C ~ 85°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA
• Supplier Device Package 900-FCBGA (31x31)
• Architecture MCU, FPGA
• ECCN 3A001A7B
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)