技术参数

• Connector Type B2B
• Size / Dimension 1.970" L x 1.570" W (50.00mm x 40.00mm)
• RAM Size 2GB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type MCU, FPGA
• Core Processor Kintex UltraScale KU035
• Flash Size 64MB
• California Prop 65 California Prop 65 Information
• ECCN 3A991D
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant