技术参数

• Package / Case 240-LFBGA
• Mounting Type Surface Mount
• Interface Host Interface, McBSP
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (32kB)
• On-Chip RAM 320kB
• Voltage - I/O 3.30V
• Voltage - Core 1.60V
• Clock Rate 160MHz
• Supplier Device Package 240-NFBGA (15x15)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant