技术参数

• Package / Case 16-SOIC (0.154", 3.90mm Width)
• Delay Time 5.5ns
• Number of Channels 1 x 1:4
• Mounting Type Surface Mount
• Output MLVDS
• Type Buffer, Multiplexer
• Input CML, LVDS, LVPECL, MLVDS
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 3V ~ 3.6V
• Applications LVDS
• Current - Supply 67mA
• Data Rate (Max) 250Mbps
• Supplier Device Package 16-SOIC
• Capacitance - Input 5 pF
• ECCN 5A991B1
• HTSUS 8542.39.0001