技术参数

• Package / Case 159-LFBGA
• Mounting Type Surface Mount
• Speed 1GHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor XBurst® 1
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 159-BGA (9x9)
• Ethernet 10/100Mbps (1)
• USB USB 2.0 OTG (1)
• Number of Cores/Bus Width 1 Core, 32-Bit
• RAM Controllers DDR2, LPDDR2, LVDDR2
• Graphics Acceleration No
• Display & Interface Controllers DVP, LCD, MIPI-CSI, RGB
• Security Features AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
• Additional Interfaces AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
• ECCN 5A992C 24
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• RoHS Status ROHS3 Compliant