技术参数

• Package / Case 169-LFBGA
• Mounting Type Surface Mount
• Interface ACPI, BC-Link, I2C/SMBus, LPC, PECI, PS/2, SPI
• RAM Size 16K x 8
• Operating Temperature 0°C ~ 85°C
• Voltage - Supply 3.3V
• Program Memory Type FLASH (192kB)
• Applications I/O Controller
• Core Processor ARC-625D
• Supplier Device Package 169-LFBGA (11x11)
• Number of I/O 135
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant