技术参数

• Package / Case 256-LFBGA
• Mounting Type Surface Mount
• Speed 400MHz
• Operating Temperature -40°C ~ 85°C (TA)
• Core Processor ARM® Cortex®-A9
• Voltage - I/O 1.2V, 3.3V
• Supplier Device Package 256-LFBGA (11x11)
• Ethernet 10/100Mbps (1), 100Mbps (1)
• USB USB 2.0 (2)
• Number of Cores/Bus Width 1 Core, 32-Bit
• Co-Processors/DSP Multimedia; NEON™ MPE
• RAM Controllers SDRAM, SRAM
• Graphics Acceleration Yes
• Display & Interface Controllers DVD, VDC
• Additional Interfaces CAN, I2C, IEBus, IrDA, LIN, MediaLB, MMC/SD/SDIO, SCI, SCI FIFO, SPDIF, SPI, SSI
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant