技术参数

• Package / Case 784-BFBGA, FCBGA
• Speed 500MHz, 1.2GHz
• RAM Size 1.8MB
• Number of I/O 128
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
• Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
• Connectivity CANbus, I2C, SPI, UART/USART, USB
• Peripherals DMA, WDT
• Supplier Device Package 784-FCBGA (23x23)
• Architecture MPU, FPGA
• ECCN 5A002A4 XIL
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant